CVD Diamond RF terminations – DC to 28 GHz, up to 100 W: JQL CVD Diamond Terminations
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CVD Diamond RF terminations – DC to 28 GHz, up to 100 W | JQL Electronics / Dorado

JQL CVD Diamond chip terminations from DC to 28 GHz and up to 100 W. Thin-film technology with wire-bondable, solderable and surface-mount integration.

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The JQL Technologies CVD Diamond Chip Terminations are compact resistive RF components designed for microwave and power applications. The listed product range covers frequencies from DC to 28 GHz with input power ratings from 15 to 100 W.

The terminations use thin-film technology on a CVD Diamond substrate. This construction is intended for applications involving CW and peak power. The components support wire-bondable, solderable and surface-mount integration.

Advantages

  • Broad RF coverage: listed models from DC to 28 GHz.
  • Power versions up to 100 W: available ratings of 15, 50 and 100 W.
  • CVD Diamond substrate: used for compact RF power components.
  • Thin-film construction: suitable for microwave and peak-power applications.
  • Flexible integration: wire-bondable, solderable and surface-mountable.
  • Small footprint: suitable for integration into RF and microwave modules.
  • Gold over Nickel terminal material: supports bonding and soldering integration.

Key features

  • Product type: CVD Diamond Chip Termination
  • Frequency range of listed models: DC to 28 GHz
  • Input power: 15 to 100 W depending on model
  • VSWR: 1.25 to 1.60 across the listed models
  • Resistor construction: Thin Film
  • Substrate: CVD Diamond
  • Terminal material: Gold over Nickel
  • Integration: Wire Bonding, soldering and Surface Mount

Typical applications

  • Isolators
  • Filters
  • High Power Amplifiers
  • Satellite Communications
  • Radar
  • RF power modules

Additional information

The JQL CVD Diamond Termination range includes several frequency and power configurations. Listed versions cover upper frequencies of 18, 20 and 28 GHz with input power ratings of 15, 50 and 100 W.

The thin-film construction on CVD Diamond combines a compact chip format with multiple integration methods. JQL specifies wire-bondable, solderable and surface-mountable installation as well as Tape & Reel or Waffle packaging.

Model comparison

Part Number Frequency VSWR Input Power (W)
JDR-0404-15-18G DC–18.0 GHz 1.25 15
JDR-0505-50-20G DC–20.0 GHz 1.60 50
JDR-0603-50-28G DC–28.0 GHz 1.60 50
JDR-066035-50-28G DC–28.0 GHz 1.60 50
JDR-0805-100-18G DC–18.0 GHz 1.50 100
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